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September 3, 2025
Participating in "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging
LINTEC has joined "JOINT3" consortium to develop next-generation semiconductor packaging.
JOINT3 is a co-creation evaluation framework established by Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter "Resonac") with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level organic interposers through collaboration among material, equipment, and design companies.
JOINT3 brings together global leaders in semiconductor supply chain. Using a prototype line for 515 x 510mm panel-level organic interposers, the consortium promotes the development of materials, equipment, and design tools optimized for panel-level organic interposers. Having focused on utilizing its proprietary technologies to produce various types of high-performance tapes and related equipment used in back-end semiconductor processes, LINTEC is now also engaged in efforts to establish technologies related to next-generation packaging, which prompted the decision to join the JOINT3 consortium.
In recent years, packaging for back-end processes has emerged as a key technology in the field of next-generation semiconductors. This includes 2.xD packages, whereby multiple semiconductor chips are arranged in parallel and connected via interposers, demand for which is expected to grow in line with the need for increased data communication capacity and speed. As semiconductor performance improves, interposers are becoming larger, and there is a shift from silicon interposers to organic interposers made from organic materials. Conventional manufacturing methods involve cutting rectangular pieces from circular wafers. However, as interposers increase in size, the number of them that can be obtained from a single wafer decreases, posing a significant challenge. To address this issue, a manufacturing process that transitions from circular wafer shapes to square panel shapes is gaining attention, as it allows for an increased number of interposers to be produced from a given area of wafer.
In JOINT3, LINTEC will also collaborate with the other companies involved, bringing the adhesive and equipment technologies that the company has cultivated to date to the creation of new proprietary technologies, contributing to the further development of semiconductor packaging technology through high-level integration of technologies and techniques.
Overview of JOINT3
JOINT3 Logo (Participating company logos)
The APLIC building (exterior image)
About Resonac
Resonac is a functional chemical company established as a result of the integration of Showa Denko and former Hitachi Chemical in January 2023. The Company's sales revenue of semiconductor and electronic materials business for 2024 was about 450 billion yen. The Company is a world-class leader particularly in semiconductor materials for packaging process. The integration of the two companies has enabled Resonac to design functions of materials as well as to develop them in-house, going all the way back to raw materials. The trade name "RESONAC" was created as a combination of two English words, namely, the word of "RESONATE" and "C" as the first letter of CHEMISTRY. The Company will make the most of its co-creative platform, and accelerate technological innovation with semiconductor manufacturers, material manufacturers, and equipment manufacturers inside and outside Japan.
For detail, please refer to our Website.
Resonac Holdings Corporation
The contents of the News Release are as of the announcement date. Please note that they may differ from the latest information.