One of the highlights for Advanced Materials Operations in the fiscal year ended March 31, 2025, was the high volume of orders received for equipment used in the manufacture of HBM. Orders and shipments for this equipment began in the second half of the fiscal year ended March 31, 2024, and recorded sales reached approximately ¥9.0 billion in the fiscal year ended March 31, 2025. While customer capital investment has begun to taper off and we believe orders have peaked, demand remains steady. For the fiscal year ending March 31, 2026, we are planning for sales of approxi-mately ¥4.0 billion. The adoption of our HBM manufacturing equipment by many of the world’s leading semiconductor manufacturers is the result of LINTEC’s core strength: the ability to accurately identify customer needs and turn those needs into reality through advanced technological develop-ment. We have earned customer trust by leveraging our system for rapidly developing, customizing, mass-producing, and delivering products that align with specific customer requirements. In addition, our global service network, with This type of tape protects the wafer surface during the back grinding process (which involves thinning the backside of the wafer by grinding), preventing contamination of the circuit sur-face by grinding water or debris.This tape is used in applications such as flip chip mounting, where chips are installed face down on the substrate. This tape protects and reinforces the backside of the chip.engineers stationed in regions around the world, enables us to quickly respond to maintenance needs or technical issues, further differentiating us from the competition. Although demand for HBM manufacturing equipment is expected to decline in the fiscal year ending March 31, 2026, sales of existing equipment, such as wafer mounters and tape laminators and removers, are projected to remain strong, continuing the momentum from the previous fiscal year. Given the outlook for continued growth in demand for semiconductor- related equipment, we are also revamping of the Ina Technology Center in Saitama Prefecture, which handles everything from design and development to production. This is expected to significantly enhance both our development and manufacturing capabilities. LINTEC provides integrated solutions that combine both materials and equipment. As the equipment we deliver enters full operation at customer factories, we anticipate a positive cycle in which demand for our semiconductor-related adhesive tapes also increases.Dicing tape firmly holds individual chips in place during dicing, then allows easy pickup after UV irradiation reduces adhesive strength.Like conventional dicing tape, dicing die bonding tape firmly secures the wafer during dicing. However, when the chips are picked up, adhesive material is transferred to the chip backside for bonding purposes.Equipment for HBM ManufacturingBack grinding tapeBackside coating tapeSemiconductor-related adhesive tapeContinued increase in demand anticipated, driven by generative AISeries Semiconductor-Related TapesForecast for Sales Changes of Advanced Materials Operations’ Three Core Products (Comparison with the Fiscal Year Ended March 31, 2025)Dicing die bonding tapeSemiconductor-related equipmentOrders for HBM manufacturing equipment expected to decline after peakingDicing tapeMultilayer ceramic capacitor-related tapeDemand projected to rise for use in smartphones and AI servers25UPDOWNUP
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