LINTEC Integrated Report 2022
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2021202220232024(Target)67.455.378.072.5Main Products• Semiconductor-related adhesive tapes• Semiconductor-related equipmentIn the previous fiscal year, we were able to ride out strong • Multilayer ceramic capacitor-related tapesnext-generation displays. We are also developing tape for semiconductor manufacturing processes that further enhance the capacity of semiconductor memories. In addition, we aim to quickly commercialize new businesses involving pellicles for extreme ultraviolet (EUV) lithography systems, which form the fine electronic circuits required for next-generation devices, and Peltier modules, which are used to cool devices.¥ Billion 080604020(Forecast)LSV 2030-Stage 1(Fiscal years ended / ending March 31)Net Sales: Advanced Materials Operations37Business Operations IntroductionWe are building a unique position in the electronics industry, which is expected to continue to record substantial growth. Our products include a variety of specialized adhesive tape that plays an important role in semiconductor manufacturing and mounting processes, and we also make equipment that fully leverages the special features of this tape. In addition, we produce and sell release film that is crucial in the production of multilayer ceramic capacitors.A Message from the Executive General Manager, Advanced Materials OperationsThe fiscal year ended March 31, 2022, was marked by strong sales of semiconductor-related tape and equipment, as well as multilayer ceramic capacitor-related tape, spurred by rapid digitalization worldwide since the onset of COVID-19. On the other hand, during the year supply chain disruptions revealed issues in the procurement of materials. market demand by operating our plants at full capacity. We are now working to increase production capacity to meet future increases in demand. We are investing a total of around ¥19.0 billion to construct new buildings for multilayer ceramic capacitor-related tape at two plants in Ehime and Saitama prefectures. For semiconductor-related adhesive tape, we are also moving forward with a plan to invest approximately ¥4.5 billion to introduce new production equipment at a plant in Gunma Prefecture. Furthermore, as part of our efforts to improve our business foundation, we will strive to reduce procurement risks by purchasing raw materials from multiple suppliers and placing bulk orders, and to continuously strengthen the sales capabilities of our overseas subsidiaries. New product development is extremely important in the rapidly changing electronics industry. We are developing tape for micro light-emitting diodes (LEDs), which are being touted as Kinya MochidaSenior Executive OfficerDeputy Executive General Manager,Business Administration Div., and Executive General Manager, Advanced Materials OperationsAdvanced Materials Operations

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