Multilayer Ceramic Capacitor-Related TapeBackside Coating Tape for Flip Chips Meeting Demand for High-Performance, Thinner Electronic DevicesConventionally, metal wires are used on semiconductor chips to connect the circuitry on the surface of the chip to the substrate. By contrast, flip chips are mounted directly on the substrate by inverting chips with protruding electrodes on the circuit surface. This approach helps improve electrical characteristics and reduce the mounting area. On the other hand, this method leaves the back side of the chip exposed, and reinforcing chips has become an issue as they become thinner. LINTEC has taken the lead over other companies in developing a tape that protects and reinforces the back side of the chip, preventing light from penetrating to the circuit surface to reduce damage. In this area, we maintain a particularly high market share, and this business contributes substantially to the Group’s profitability.Multilayer Ceramic Capacitor Manufacturing ProcessBackside coating tape for flip chipsDielectric paste (slurry)CoatingStacking, compression bonding, and cuttingCeramic sheetHeat dryingInternal electrode printingChipWireAdhesiveSubstrateMounting Using WiresChipBumpAdhesiveSubstrateFlip Chip Mounting555.9440.4412.30High-performance smartphones:テープApproximately 1,000Flat-screen TVs:Approximately 1,000(Forecast)(Forecast)ChipWireAdhesiveSubstrateChipBumpAdhesiveMultilayer ceramic capacitors, which function to store electricity and regulate current, are tiny electronic components, Substratesome of which measure less than 0.25 mm in size. Inside these capacitors are ceramic sheets numbering anywhere from several hundred to nearly one thousand that are less than 1/1,000 mm thick and have electrodes printed on them. The LINTEC Group’s multilayer ceramic capacitor-related tape, which is manufactured using precision thin-film coating technology, is used to form the ceramic sheet. This tape has earned a strong market reputation for its excellent surface smoothness, heat resistance, and release properties. We supply this tape to major capacitor manufacturers. Our tape is used mainly for high-end products that require particularly high quality.633.2662.4(Year)High Quality for High-End Products型抜き・剝離LINTEC’s tapePlatingFiring and external electrode formingMounting Using WiresFlip Chip MountingNumber of Multilayer Ceramic Capacitors UsedGlobal Semiconductor Market Forecast23内部電極部電極印刷Chip貫通電極バンプ粘着剤チップ基板800600400200201920202021Source: World Semiconductor Trade Statistics (WSTS)テープElectric vehicles: Approximately 10,000Notebook PCs:Approximately 800US$ BillionChip貫通電極バンプ粘着剤チップ基板20222023An Eye to Further Demand GrowthIn response to the recent global shortage of semiconductors, semiconductor manufacturers are stepping up investment to increase production. Going forward, the semiconductor market is expected to grow due to the further adoption of AI, advances in the Internet of Things (IoT), evolution of automo-tive electronics, and the spread of high-speed communication standards. At the same time, the number of multilayer ceramic capacitors used in elec-tronic equipment, automobiles, and other applications is increasing, and higher levels of performance are being required. In light of these market trends, we are also moving forward with capital investment plans to expand our capacity to manufacture electronics-related products. We will continue to contribute to the digitalization of society and expand our business through manufacturing that meets customer needs, including by improving quality and adapting to new production processes.
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