Value CreationSpecial Feature 1Fundamental Manufacturing Process for Semiconductor Chips (Back-End Process)First, the back side of the wafer on which the circuit is formed is ground down with a grindstone to make it thinner. The LINTEC Group offers surface protective tape, which protects circuit surfaces from grinding fluid and debris, and equipment for application and removal of the tape.Next, wafers are cut into individual chips. Dicing tape is used to attach wafers to a ring frame and prevent them from flying off during cutting. The LINTEC Group boasts the world’s top market share for this tape.Irradiation with UV light reduces the adhesive strength of the dicing tape, so the cut chips can be picked up and mounted on a substrate. The LINTEC Group also offers a lineup of dicing die bonding tape that allows for mounting directly to substrates by transferring the adhesive from the tape to the back side of the chip.Semiconductor chips are made by forming electronic circuits on the surface of wafers (thin silicon disks), which are then cut into individual chips. These chips serve as the brains of electronic devices, processing and storing information. The LINTEC Group’s lineup includes the various adhesive tape used in the “back-end process.” In this process, wafers are ground thin after circuits are formed on to them. The wafers are then cut, mounted on substrates, and packaged. We have also designed our own equipment for applying and releasing tape, and we have established a unique position in the market by proposing processes that combine tape and equipment.Process Proposal Combining Tape and EquipmentBack GrindingDicingPicking Up and MountingSurface protective tapes and laminator for back grindingDicing tapes and laminator for fixing wafers in placeDicing die bonding tapes and UV irradiation system22As digitalization progresses, each year we are seeing increases in the number of electronic components in smartphones, personal computers, and other devices, as well as in automobiles and consumer electronics. Notably, we posted record earnings in the fiscal year ended March 31, 2022, in Advanced Materials Operations, the business division that focuses on electronics-related products such as various tape and equipment essential for the manufacturing of semiconductor chips and multilayer ceramic capacitors. In this section, we will introduce the LINTEC Group’s electronics-related products.Semiconductor-Related ProductsLINTEC’s Electronics-Related Business
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