Integrated Report 2020

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Multilayer ceramic capacitor-related tapesThese release films are used in forming hundreds of ultra-thin ceramic layers to configurate the interior structure of the capacitors.Optical display-related adhesive productsThese are products that have undergone precision adhesive coating for lamination of optically functional films, which are essential components for LCDs and OLED displays.Semiconductor-related adhesive tapesThese specialty adhesive tapes are used in the semiconductor manufacturing back-end processes. They are used to protect the circuit surface when thinning semiconductor wafers through grinding, to secure wafers during dicing, etc.Semiconductor-related equipmentThese products, which are used in semiconductor manufacturing back–end processes, include equipment for laminating/removing semiconductor–related adhesive tapes and for UV irradiation of tapes to control adhesion of the tapes.Specialty papersPapers used in special applications have a variety of colors, textures, and functions, etc. They include the color papers for envelopes and colored construction papers as well as the papers used in laundry tags which have tear-resistance even when soaked with water, and the papers used in food packaging show oil and water seepage resistance.Window filmsThese adhesive films are applied to window glass in buildings, automobiles, etc. They have various effects such as improving air-conditioning efficiency in rooms and vehicles, shielding ultraviolet rays, and reducing the scattering of splinters when glass is broken.Diagram of Adhesive Products for LabelsFacestockBroadly divided, there are two types—paper and film—and can be selected based on the application, usage environment, and required performance.AdhesiveIn line with purpose and application, it can be selected from a permanent type, a removable type, or a re-applicable type.Release paper / filmIn addition to the protection of the adhesive surface, the paper and film are used as a base during label manufacturing and processing.LINTEC Integrated Report 2020107