Integrated Report 2019

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43LINTEC INTEGRATED REPORT 2019Contributing to the Future of the Automobile Industry Through Material Development TechnologiesMoving forward, automobile-related products are a one of the field that will be the focus of special attention in the new material devel-opment and proposal initiatives of each business operations. This market is also undergoing a move toward electrification, including the growing use of electric vehicles and the installation of advanced driving support systems, and LINTEC will strive to provide a thor-ough response to the market needs.Steadily Reinforcing Our Position in the Semiconductor-Related Products MarketLINTEC made a full-scale entry into the semiconductor-related products market in 1986 with the development of UV curable dicing tape. Subsequently, accompanying technical innovation in the semiconductor production process, we have worked to expand our business by steadily expanding the range of applications for our original tape technologies.Wafer surface protective tapeSemiconductor Production Process Using Tape for SDBGFull touch screens are finding growing use as onboard moni-tors. We have developed highly functional optically double-sided adhesive sheets that are used to bond resin cover panels, which are lighter and more workable than glass, to LCDs or other types of display modules. These sheets, which have earned high evaluations in the market, meet the rigorous durability standards required for use in automotive applications and also boast superior transparency. We have also prevented the for-mation of spot-shaped bubbles caused by outgassing from the plastic resin. In addition, these sheets offer gap-filling ability in regard to the uneven areas on the printed section of the cover panel frame.Generally, circuits are formed on the surface of disc-shaped semiconductor wafers, which are then thinned through back grinding. The wafers are then diced with a blade to produce individual chips. SDBG* is a process technology in which a laser is used to make cuts in the wafer in advance. The wafer is then subject to back grinding, after which individual chips are separated by expanding the wafer. This process requires extremely high capabilities in the surface protective tape that is used to protect the circuit surface during back grinding. By developing tape that meets these requirements, LINTEC is establishing a solid position in the market for these tapes.* SDBG: Stealth Dicing Before GrindingNote: “Stealth Dicing” is a dicing technology developed by Hamamatsu Photonics K.K.Diagram of an Onboard Touch ScreenLiquid crystalResin cover panelGlass with transparentelectrodesOptically clear adhesive sheetsOnboard Optically Clear Adhesive SheetsWafer Surface Protective Tape for Use in SDBG12563748Surfaceprotective tapeStealth dicingBacksideLaserBack grindingDicing tapeRemoval of surface protective tapeDie separationthrough expansionPick upMountingApplication of tapeCircuitsurfaceReverseReverseApplication of tapeESGStrategyOverviewFinancial Information